Mfr Package Description PLASTIC, BGA-357

Status Transferred

Address Bus Width 32.0

Bit Size 32

Clock Frequency-Max 66.0  MHz

External Data Bus Width 32.0

JESD-30 Code S-PBGA-B357

JESD-609 Code e0

Number of Terminals 357

Operating Temperature-Min 0.0  Cel

Package Body Material PLASTIC/EPOXY

Package Code BGA

Package Equivalence Code BGA357,19X19,50

Package Shape SQUARE

Package Style GRID ARRAY

Power Supplies 3.3

Qualification Status Not Qualified

Seated Height-Max 2.05  mm

Speed 66.0  MHz

Sub Category Other Microprocessor ICs

Supply Voltage-Nom 3.3  V

Supply Voltage-Min 3.135  V

Supply Voltage-Max 3.465  V

Surface Mount YES

Technology CMOS

Terminal Finish TIN LEAD

Terminal Form BALL

Terminal Pitch 1.27  mm

Terminal Position BOTTOM

Length 25.0  mm

Width 25.0  mm