W25P010AF6

New And Original + Factory sealed Package

W25P010AF6 IC Component Original New Stock


Manufacturer: Winbond Electronics Corp
Date code: 2022+ / 2023+
Package Type: QFP-100
Available Qty: More Than 1000 pcs

Mfr Package Description MO-108, QFP-100

REACH Compliant Yes

Status Discontinued

Sub Category SRAMs

Access Time-Max 6.0  ns

I/O Type COMMON

JESD-30 Code R-PQFP-G100

JESD-609 Code e0

Memory Density 1048576.0  bit

Memory IC Type STANDARD SRAM

Memory Width 32

Number of Functions 1

Number of Terminals 100

Number of Words 32768.0  words

Number of Words Code 32K

Operating Mode SYNCHRONOUS

Operating Temperature-Min 0.0  Cel

Operating Temperature-Max 70.0  Cel

Organization 32KX32

Output Characteristics 3-STATE

Package Body Material PLASTIC/EPOXY

Package Code QFP

Package Equivalence Code QFP100,.7X.9

Package Shape RECTANGULAR

Package Style FLATPACK

Parallel/Serial PARALLEL

Qualification Status Not Qualified

Seated Height-Max 3.32  mm

Standby Current-Max 0.001  Amp

Supply Current-Max 0.25  Amp

Supply Voltage-Nom (Vsup) 3.3  V

Supply Voltage-Min (Vsup) 3.15  V

Supply Voltage-Max (Vsup) 3.6  V

Surface Mount YES

Technology CMOS

Temperature Grade COMMERCIAL

Terminal Finish TIN LEAD

Terminal Form GULL WING

Terminal Pitch 0.65  mm

Terminal Position QUAD

Length 20.0  mm

Width 14.0  mm