Part#: UCN5895EP
Part Category: Interface ICs

Manufacturer: Allegro MicroSystems Europe Ltd.

Description: SIPO Based Peripheral Driver, 8 Driver, …

The UCN5895A, UCN5895EP, and A5895SLW BiMOS II serialinput, latched source drivers are designed for applications emphasizing
low output saturation voltages and currents to -250 mA per output.
These smart high-side octal, driver ICs merge an 8-bit CMOS shift
register, associated CMOS latches, and CMOS control logic (strobe
and output enable) with medium current emitter-follower (sourcing)
outputs. Typical applications include incandescent or LED displays
(both directly driven and multiplexed), non-impact (i.e., thermal)
printers, relays, and solenoids.
Each device is suitable for high-side applications to -250 mA per
channel. The maximum supply voltage is 50 V and a minimum output
sustaining voltage rating of 35 V for inductive load applications. Under
normal operating conditions, the UCN5895A and UCN5895EP are
capable of providing -120 mA (8 outputs continuous and simultaneous)
at +65°C with a logic supply of 5 V. Similar devices, with higher output
current ratings, are the UCN5890A and UCN5891A.
BiMOS II devices can operate at greatly improved data-input rates.
With a 5 V supply, they will typically operate at better than 5 MHz.
At 12 V, significantly higher speeds are obtained.
The CMOS inputs provide for minimum loading and are compatible
with standard CMOS, PMOS, and NMOS circuits. TTL or DTL circuits
may require the use of appropriate pull-up resistors to ensure a proper
input-logic high. A CMOS serial data output allows cascading these
devices in multiple drive-line applications required by many dot matrix,
alphanumeric, and bar graph displays.
These devices are rated for continuous operation over the temperature range of -20°C to +85°C. Because of limitations on package
power dissipation, the simultaneous operation of all output drivers may
require a reduction in duty cycle. The UCN5895A is supplied in a
standard 16-pin dual in-line plastic package with a copper lead frame
for increased allowable package power dissipation. The UCN5895EP
is supplied in a 20-lead plastic leaded chip carrier for minimum area,
surface-mount applications. The A5895SLW is supplied in a 16-lead
wide-body plastic SOIC.