XPC860PZP66D3
XPC860PZP66D3 IC Component Original New Stock
Mfr Package Description PLASTIC, BGA-357
Status Discontinued
Address Bus Width 32.0
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 66.0 MHz
External Data Bus Width 32.0
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B357
Low Power Mode YES
Number of Terminals 357
Operating Temperature-Min 0.0 Cel
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Power Supplies 3.3
Qualification Status Not Qualified
Seated Height-Max 2.05 mm
Speed 66.0 MHz
Sub Category Other Microprocessor ICs
Supply Voltage-Nom 3.3 V
Supply Voltage-Min 3.135 V
Supply Voltage-Max 3.465 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Length 25.0 mm
Width 25.0 mm
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